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AI Data Center Container (Liquid Cooling)

Prefabricated modular liquidcooled container for AI/HPC. Integrates racks, power, UPS, cooling, fire suppression. 100kW10+MW, 150kW+/rack. Rapid, scalable outdoor. 

Applicable Scenarios

  • AI and High-Density Computing
  • Cloud Service Providers
  • Telecom and 5G Edge
  • Financial Services
  • Government and Public Sector
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  • Description
  • Product Parameters
  • Advantages
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Description

The Containerized Liquid Cooling Data Center is a factory‑prefabricated, modular solution purpose‑built for high‑density AI and HPC workloads. It integrates IT racks, power distribution, UPS, cold‑plate liquid cooling, fire suppression, and intelligent monitoring into rugged container modules. Available in all‑in‑one or functional modular architectures, it supports flexible cluster deployment from 100 kW to 10+ MW, with rack densities up to 150 kW+. Designed for outdoor deployment in harsh environments, it delivers rapid deployment, exceptional energy efficiency, and scalable capacity for AI training, HPC, cloud, and edge computing.

Product Parameters

Parameter Specification
Enclosure Customized
Power Density 100 kW/rack (Liquid-Cooling)
IT Capacity Customized
UPS Redundancy 2N or N+1
Battery Backup 10-min Autonomy (Lithium battery)

Water chiller and plate heat exchanger with free cooling. Heat is rejected through

a cooling tower. Hybrid air/liquid cooling system.

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Fire Safety Novec 1230 & VESDA

Advantages

  • Ultra‑High Density

    Ultra‑High Density

    Supports up to 150 kW per rack with cold‑plate liquid cooling, enabling dense GPU/AI clusters in minimal footprint.

  • Rapid Deployment

    Rapid Deployment

    Factory‑prefabricated and pre‑tested modules reduce on‑site installation time by up to 60% compared to traditional data centers.

  • Scalable Capacity

    Scalable Capacity

    Scales from 100 kW to 10+ MW with modular 1.25 MW building blocks, supporting phased expansion and flexible cluster configurations.

  • Superior Energy Efficiency

    Superior Energy Efficiency

    Dual‑loop isolated liquid cooling with chip‑level heat capture and N+1 redundancy delivers high thermal performance and low PUE.

Download

  • Data center container.pdf
  • Product Brochure.pdf

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Service & After-Sales Support

Service & After-Sales Support

24/7 expert assistance ensuring continuous stable data center operations.
On-site U.S. engineers for rapid deployment and troubleshooting as needed.
Professional after-sales team ensures installation, commissioning, and long‑term reliability.
Real-time remote diagnostics and maintenance via our secure support platform.

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