The Nebula Series liquid cooling micro-module is a factory-preintegrated turnkey data center solution, specially developed to solve the heat dissipation bottleneck of high-density AI training clusters, high-performance computing (HPC) and hyperscale cloud infrastructure.
Breaking the power limit of traditional air cooling micro-modules, it adopts advanced liquid cooling technology with a standardized underframe fluid pipeline system to efficiently export massive heat from high-wattage servers.
The whole system is equipped with facial recognition access control and a central HMI touchscreen dashboard, supporting role-based permission management. Built-in sensors enable 24/7 remote monitoring of coolant circulation, power distribution, temperature and equipment operation status, allowing predictive maintenance to greatly reduce unexpected downtime.
The elevated rigid steel frame optimizes pipeline layout, lowering the difficulty of on-site installation and daily maintenance, while supporting modular parallel splicing for flexible capacity expansion. All units complete full-function testing and pre-commissioning in the factory, shortening on-site deployment cycles by more than 65% compared with conventional data center construction.
It is ideal for AI computing hubs, university supercomputing labs, enterprise high-end IT upgrades and colocation facility renovation, delivering outstanding scalability, operational stability and long-term TOC optimization for global enterprise clients.
AI & High-Density Computing
Cloud Service Providers
Financial Services
Government & Public Sector
Telecom & 5G Edge
End-to-End Customization: Tailored solutions designed for specific computing capacity and regional standardscovering design, production, and delivery
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